![]() ![]() ![]() Simulation-led design helps better manage innovation and addresses increasing product complexity, shorter product life cycles and growing expectations from consumers. The partnership between Ansys and Autodesk is founded on breaking down engineering silos in the product design process and democratizing simulation technology to designers and engineers. By combining the Fusion 360 cloud-based software platform for PCB design with Ansys’ market-leading electromagnetic capabilities, PCB designers and engineers can gain insights into the performance of their designs at every step of the process to increase confidence that the resulting product will work as planned the first time and every time. These concerns are addressed with the Autodesk Fusion 360 Signal Integrity Extension, powered by Ansys. Rushing a design through to production without absolute confidence in its performance and simply hoping for the best could lead to costly re-spins and time-to-market delays. The shrinking of printed circuit boards (PCBs) and their components with every new product generation requires that the high-speed transmission lines (traces on a PCB) become smaller and more closely packed, increasing the likelihood of signaling problems from noise and interference.Īt the same time, customer demands for quicker availability of new products means less time for engineers to design and test their latest innovations. ![]() The chances for signal interference and timing delays in these systems, among other key properties, are constantly increasing. Here’s a metric that brings home the ever-increasing speed of electronic devices: TVs that can handle 4K videos support frequency ranges of 1.4 GHz or higher. As the electrification of so many of the products we use every day accelerates and intensifies, the market demands faster, smaller, smarter electronics at an ever more rapid pace, which means engineers are tasked with navigating increasingly complex challenges in a hurry.
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